A low-density potting compound /
The development of certain electronic packages for missile and airborne applications has created a need for a lightweight potting compound that offers greater environmental protection than that provided by the available polyurethane foams. Preliminary efforts indicated that this objective could be b...
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| Main Author: | |
|---|---|
| Corporate Authors: | , |
| Format: | Government Document Book |
| Language: | English |
| Published: |
Albuquerque, New Mexico : Washington, D.C. :
Sandia Corporation, Technical Information Division ; Available from the Office of Technical Services, Dept. of Commerce,
1961.
|
| Series: | Sandia Corporation reprint ;
SCR-417A. |
| Subjects: |
MARC
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| 027 | |a SCR-417A | ||
| 035 | |a (OCoLC)776878493 | ||
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| 100 | 1 | |a Quant, A. J. | |
| 245 | 1 | 2 | |a A low-density potting compound / |c by A.J. Quant. |
| 264 | 1 | |a Albuquerque, New Mexico : |b Sandia Corporation, Technical Information Division ; |a Washington, D.C. : |b Available from the Office of Technical Services, Dept. of Commerce, |c 1961. | |
| 300 | |a 31 pages : |b illustrations ; |c 28 cm. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a unmediated |b n |2 rdamedia | ||
| 338 | |a volume |b nc |2 rdacarrier | ||
| 490 | 1 | |a Sandia Corporation reprint ; |v SCR-417A | |
| 500 | |a "June 1961." | ||
| 500 | |a "TID-4500 (16th Edition) ; Chemistry--Plastics." | ||
| 520 | 3 | |a The development of certain electronic packages for missile and airborne applications has created a need for a lightweight potting compound that offers greater environmental protection than that provided by the available polyurethane foams. Preliminary efforts indicated that this objective could be best achieved by incorporating low-density fillers into conventional epoxy resins. | |
| 588 | |a This bibliographic record is available under the Creative Commons CC0 "No Rights Reserved" license. The University of Florida Libraries, as creator of this bibliographic record, has waived all rights to it worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. | ||
| 583 | 1 | |a will digitize |c 20160322 |z Queued for digitization March 22, 2016 |2 pda |5 miu | |
| 650 | 0 | |a Potting compounds (Electronics) | |
| 650 | 0 | |a Epoxy resins. | |
| 650 | 7 | |a Epoxy resins |2 fast |0 (OCoLC)fst00914409 | |
| 650 | 7 | |a Potting compounds (Electronics) |2 fast |0 (OCoLC)fst01073909 | |
| 710 | 2 | |a Sandia Corporation. | |
| 710 | 2 | |a U.S. Atomic Energy Commission | |
| 730 | 0 | |a Technical Report Archive & Image Library (TRAIL) | |
| 776 | 0 | 8 | |i Online version: |a Quant, A. J. |t Low-density potting compound |w (OCoLC)956621938 |
| 830 | 0 | |a Sandia Corporation reprint ; |v SCR-417A. | |
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