A low-density potting compound /
The development of certain electronic packages for missile and airborne applications has created a need for a lightweight potting compound that offers greater environmental protection than that provided by the available polyurethane foams. Preliminary efforts indicated that this objective could be b...
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| Main Author: | |
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| Corporate Authors: | , |
| Format: | Government Document Book |
| Language: | English |
| Published: |
Albuquerque, New Mexico : Washington, D.C. :
Sandia Corporation, Technical Information Division ; Available from the Office of Technical Services, Dept. of Commerce,
1961.
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| Series: | Sandia Corporation reprint ;
SCR-417A. |
| Subjects: |