Advances in thermal modeling of electronic components and systems.

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Bibliographic Details
Format: Serial
Language:English
Published: New York : Hemisphere Pub. Corp., c1988-
Subjects:

University of St. Thomas

Holdings details from University of St. Thomas
Call Number: TA418.58 .A38

University of Minnesota

Holdings details from University of Minnesota
Call Number: TK7870.25 .A34