Proceedings /
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| Previous Title: | International Conference on Wafer Scale Integration. Proceedings |
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| Corporate Authors: | , , |
| Format: | Conference Proceeding |
| Language: | English |
| Published: |
[New York, N.Y.] :
Institute of Electrical and Electronics Engineers,
©1996-
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| Subjects: |
| Published: | 8th (1996)- |
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| Physical Description: | volumes : illustrations ; 23 cm |
| Publication Frequency: | Annual |
| ISSN: | 1063-2204 |