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Bibliographic Details
Previous Title:	International Conference on Wafer Scale Integration. Proceedings
Corporate Authors:	International Conference on Innovative Systems in Silicon, IEEE Computer Society, Components, Packaging & Manufacturing Technology Society
Format:	Conference Proceeding
Language:	English
Published:	[New York, N.Y.] : Institute of Electrical and Electronics Engineers, ©1996-
Subjects:	Integrated circuits > Wafer-scale integration > Congresses. Integrated circuits > Very large scale integration > Congresses

University of Minnesota

Holdings details from University of Minnesota
Call Number:	TK7874 .I5758x