Thermomechanical couplings in solids : Jean Mandel memorial symposium, Paris France, 1-5 September, 1986 /

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Bibliographic Details
Corporate Authors:	International Union of Theoretical and Applied Mechanics, I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids"
Other Authors:	Mandel, Jean, Bui, Huy Duong, Nguyen, Q. S.
Format:	Conference Proceeding Book
Language:	English
Published:	Amsterdam ; New York : New York, N.Y., U.S.A. : North-Holland ; Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., 1987.
Subjects:	Thermal stresses > Congresses. Thermoelasticity > Congresses. Coupled problems (Complex systems) > Congresses. Materials > Testing > Congresses

University of Minnesota

Holdings details from University of Minnesota
Call Number:	TA418.58 .T46 1987